TMJ316BB7474KLHT [TAIYO YUDEN]

CAP CER 0.47UF 25V X7R 1206;


型号：	TMJ316BB7474KLHT
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	CAP CER 0.47UF 25V X7R 1206
文件：	总49页 (文件大小：959K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

[ For High Quality and/or Reliability Equipment

Notice for TAIYO YUDEN Products

(Automotive Electronic Equipment / Industrial Equipment)

]

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2018. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully

before practical application or use of our products.

Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or

equipment incorporating our products, which are caused under the conditions other than those speciﬁed in this

catalog or individual product speciﬁcation sheets.

■ Please contact TAIYO YUDEN for further details of product speciﬁcations as the individual product speciﬁcation

sheets are available.

■ Please conduct validation and verification of our products in actual condition of mounting and operating

environment before using our products.

■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA

equipment, home electric appliances, office equipment, information and communication equipment), medical

equipment classiﬁed as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc.

Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which

may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,

automotive powertrain control system, train control system, and ship control system, traffic signal equipment,

medical equipment classiﬁed as Class III by IMDRF).

Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,

aerospace equipment, aviation equipment*, medical equipment classiﬁed as Class IV by IMDRF, nuclear control

equipment, undersea equipment, military equipment).

*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,

in-ﬂight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements speciﬁed separately by TAIYO YUDEN.

Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.

When our products are used even for high safety and/or reliability-required devices or circuits of general electronic

equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to

install a protection circuit as necessary.

Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way

responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog

for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.

■ Information contained in this catalog is intended to convey examples of typical performances and/or applications

of our products and is not intended to make any warranty with respect to the intellectual property rights or any

other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.

■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and

TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.

Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality

assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in

accordance with such agreement.

■ The contents of this catalog are applicable to our products which are purchased from our sales offices or

authorized distributors (hereinafter“TAIYO YUDENs’ofﬁcial sales channel”). Please note that the contents of this

catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales

channel.

■ Caution for Export

Some of our products listed in this catalog may require speciﬁc procedures for export according to“U.S. Export

Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable

regulations. Should you have any questions on this matter, please contact our sales staff.

Automotive Application Guide

We classify automotive electronic equipment into the following four application categories and set usable

application categories for each of our products. When using our products for automotive electronic

equipment, please be sure to check such application categories and use our products accordingly. Should

you have any questions on this matter, please contact us.

Category

Automotive Electronic Equipment (Typical Example)

・Engine ECU (Electronically Controlled Fuel Injector)

・Cruise Control Unit

・4WS (4 Wheel Steering)

・Automatic Transmission

POWERTRAIN

・Power Steering

・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC)

・Automotive Locator (Car location information providing device), etc.

・ABS (Anti-Lock Brake System)

・ESC (Electronic Stability Control)

・Airbag

SAFETY

・ADAS (Equipment that directly controls running, turning and stopping), etc.

・Wiper

・Automatic Door

・Power Window

・Keyless Entry System

・Electric Door Mirror

・Interior Lighting

・LED Headlight

・TPMS (Tire Pressure Monitoring System)

・Anti-Theft Device (Immobilizer), etc.

・Car Infotainment System

・ITS/Telematics System

・Instrument Cluster

BODY & CHASSIS

INFOTAINMENT

・

ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc.

▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspeciﬁcationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspeciﬁcationꢀsheets.ꢀ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

MULTILAYER CERAMIC CAPACITORS

REFLOW

AEC- Q200

■PART NUMBER

△＝Blank space

△

⑤

△

⑫

①

②

③

④

⑥

⑦

⑧

⑨

⑩

⑪

①Rated voltage

③End termination

Code

Rated voltage［VDC］

Code

End termination

Plated

6.3

Soft Termination

Cu Internal Electrodes (For High Frequency)

High Reliability Application

④Dimension（L×W）

Dimensions

EIA（inch）

Type

063

（L×W）［mm］

100

250

630

0.6 × 0.3

1.0 × 0.5

0.52× 1.0

1.6 × 0.8

0.8 × 1.6

2.0 × 1.25

1.25× 2.0

3.2 × 1.6

3.2 × 2.5

4.5 × 3.2

0201

0402

0204

0603

0306

0805

0508

1206

1210

1812

105

※

②Series name

107

212

Code

Series name

Multilayer ceramic capacitor

Multilayer ceramic capacitor for high frequency

LW reverse type multilayer capacitor

316

325

432

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code

△

Type

ALL

063

L［mm］

W［mm］

T［mm］

Standard

0.6±0.05

1.0±0.10

0.3±0.05

0.5±0.10

105

0.5±0.10

107

1.6＋0.15/－0.05

0.8＋0.15/－0.05

0.85±0.10

212

2.0＋0.15/－0.05

1.25＋0.15/－0.05

1.6±0.20

316

325

105

107

3.2±0.20

1.6±0.20

3.2±0.30

2.5±0.30

1.0＋0.15/－0.05

1.6＋0.20/－0

0.5＋0.15/－0.05

0.8＋0.20/－0

0.5＋0.15/－0.05

0.8＋0.20/－0

0.85±0.10

212

2.0＋0.20/－0

1.25＋0.20/－0

1.6±0.30

316

105

107

212

3.2±0.30

1.6±0.30

1.0＋0.20/－0

1.6＋0.25/－0

2.0＋0.25/－0

2.0±0.15

0.5＋0.20/－0

0.8＋0.25/－0

1.25＋0.25/－0

1.25±0.15

0.5＋0.20/－0

0.8＋0.25/－0

1.25＋0.25/－0

0.85±0.15

1.15±0.20

316

325

3.2±0.20

1.6±0.20

3.2±0.50

2.5±0.30

Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS

△= Blank space

⑥Temperature characteristics code

■High dielectric type

Applicable

Temperature

Ref. Temp.［℃］

range［℃］

Capacitance

tolerance

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

Tolerance

Code

Capacitance change

±15％

standard

code

EIA

X5R

X6S

X7R

X7S

X7T

－55～＋ 85

－55～＋105

－55～＋125

±22％

±15％

±22％

＋22％/－33％

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■Temperature compensating type

Applicable

Temperature

range［℃］

Capacitance

tolerance

±0.1pF

±0.25pF

±0.5pF

±1pF

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

0±30ppm/℃

standard

code

JIS

EIA

－55～＋125

C0G

±2％

±5％

⑦Nominal capacitance

⑨Thickness

Code

Thickness［mm］

0.3

Nominal capacitance

（example）

0R5

0.5pF

1pF

010

0.5

100

10pF

0.7(107type or more)

101

100pF

1,000pF

0.01μF

0.1μF

1.0μF

10μF

100μF

0.8

102

0.85(212type or more)

103

1.15

1.25

1.6

104

105

106

1.9

107

2.5

Note : R＝Decimal point

⑩Special code

Code

⑧Capacitance tolerance

Special code

Code

Capacitance tolerance

±0.05pF

±0.1pF

MLCC for Industrial and Automotive

⑪Packaging

±0.25pF

±0.5pF

Code

Packaging

φ178mm Taping （2mm pitch）

±2％

φ178mm Embossed Taping （4mm pitch）

φ178mm Taping （4mm pitch）

±5％

±10％

φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

±20％

⑫Internal code

Code

△

Internal code

Standard

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■STANDARD EXTERNAL DIMENSIONS

Dimension [mm] （inch）

Type( EIA )

0.6±0.03

0.3±0.03

0.15±0.05

□MK063（0201）

(0.024±0.001)

1.0±0.05

(0.012±0.001)

0.5±0.05

(0.012±0.001)

0.5±0.05

(0.006±0.002)

0.25±0.10

□MK105（0402）

□MF105（0402）

Ｆ

(0.039±0.002)

0.52±0.05

(0.020±0.002)

1.0±0.05

(0.020±0.002)

0.3±0.05

(0.010±0.004)

0.18±0.08

□WK105（0204）※

(0.020±0.002)

1.6±0.10

(0.039±0.002)

0.8±0.10

(0.012±0.002)

0.8±0.10

(0.007±0.003)

0.35±0.25

□MK107（0603）

□MF107（0603）

(0.063±0.004)

1.6±0.10

(0.031±0.004)

0.8±0.10

(0.031±0.004)

0.8±0.10

(0.014±0.010)

0.35＋0.3/－0.25

(0.014＋0.012/－0.010)

0.35±0.25

□MJ107（0603）

□VS107（0603）

□WK107（0306）※

(0.063±0.004)

1.6±0.10

(0.031±0.004)

0.8±0.10

(0.031±0.004)

0.7±0.10

(0.063±0.004)

0.8±0.10

(0.031±0.004)

1.6±0.10

(0.028±0.004)

0.5±0.05

(0.014±0.010)

0.25±0.15

(0.031±0.004)

(0.063±0.004)

(0.020±0.002)

0.85±0.10

(0.010±0.006)

(0.033±0.004)

1.25±0.10

□MK212（0805）

□MF212（0805）

2.0±0.10

1.25±0.10

0.5±0.25

(0.079±0.004)

(0.049±0.004)

(0.020±0.010)

(0.049±0.004)

0.85±0.10

※ LW reverse type

(0.033±0.004)

1.25±0.10

2.0±0.10

1.25±0.10

0.5＋0.35/－0.25

□MJ212（0805）

(0.079±0.004)

(0.049±0.004)

（0.020＋0.014/－0.010）

(0.049±0.004)

0.85±0.10

2.0±0.10

(0.079±0.004)

1.25±0.15

1.25±0.10

(0.049±0.004)

2.0±0.15

0.5±0.25

(0.020±0.010)

0.3±0.2

□VS212（0805）

(0.033±0.004)

0.85±0.10

□WK212（0508）※

(0.049±0.006)

(0.079±0.006)

(0.033±0.004)

(0.012±0.008)

1.15±0.10

(0.045±0.004)

□MK316（1206）

□MF316（1206）

3.2±0.15

1.6±0.15

0.5＋0.35/－0.25

(0.126±0.006)

(0.063±0.006)

（0.020＋0.014/－0.010）

1.6±0.20

(0.063±0.008)

1.15±0.10

Ｆ

(0.045±0.004)

3.2±0.15

1.6±0.15

0.6＋0.4/－0.3

□MJ316（1206）

(0.126±0.006)

(0.063±0.006)

（0.024＋0.016/－0.012）

1.6±0.20

(0.063±0.008)

1.15±0.10

(0.045±0.004)

1.9±0.20

□MK325（1210）

□MF325（1210）

3.2±0.30

2.5±0.20

0.6±0.3

(0.075±0.008)

2.5±0.20

(0.126±0.012)

(0.098±0.008)

(0.024±0.012)

(0.098±0.008)

1.9±0.20

(0.075±0.008)

2.5±0.20

3.2±0.30

2.5±0.20

0.6＋0.4/－0.3

□MJ325（1210）

□MK432（1812）

(0.126±0.012)

(0.098±0.008)

（0.024＋0.016/－0.012）

(0.098±0.008)

2.5±0.20

4.5±0.40

3.2±0.30

0.9±0.6

(0.177±0.016)

(0.126±0.012)

(0.098±0.008)

(0.035±0.024)

Note : ※. LW reverse type, *1.Thickness code

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■STANDARD QUANTITY

Dimension

Standard quantity［pcs］

Type

063

EIA（inch）

［ｍｍ］

0.3

Code

Paper tape

Embossed tape

－

0201

15000

0402

0.5

105

10000

－

0204 ※

0.30

0.7

4000

0.8

3000

0603

0.8

107

（Soft Termination）

3000

－

（Soft Termination）

0306 ※

0805

0.50

0.85

1.25

－

4000

－

4000

－

3000

212

316

2000

1.25

－

（Soft Termination）

0508 ※

1206

0.85

1.15

1.6

4000

－

3000

2000

－

1.15

1.9

－

2000

325

432

1210

1812

2.5

－

500（T），1000（P）

500

2.5

Note : ※.LW Reverse type（□WK）

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

・ All the Multilayer Ceramic Capacitors of the catalog lineup are RoHS compliant.

・ Capacitance tolerance code is applied to [] of part number.

・ All the Multilayer Ceramic Capacitors in the catalog lineup are applicable for reflow-soldering.

Note)

・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels.

・ *1: Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products.

ꢀꢀ＜ꢀꢀꢀꢀꢀꢀꢀꢀꢀ：AEC-Q200 qualified＞

AEC-Q200

ꢀꢀꢀꢀꢀAll the Multilayer Ceramic Capacitors ofꢀ*1 marks are tested based on the test conditions and methods defined in AEC-Q200 by family item.

ꢀꢀꢀꢀꢀ125℃ꢀproducts：ꢀAEC-Q200ꢀGrade1 (we conduct the evaluation at the test condition of Grade1.)

ꢀꢀꢀꢀꢀ105℃ꢀproducts：ꢀAEC-Q200ꢀGrade2 (we conduct the evaluation at the test condition of Grade2.)

ꢀꢀꢀꢀꢀꢀ85℃ꢀproducts：ꢀAEC-Q200ꢀGrade3 (we conduct the evaluation at the test condition of Grade3.)

ꢀꢀꢀꢀꢀPlease consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc.,

ꢀꢀꢀꢀꢀand please review andꢀapprove TAIYO YUDEN's product specification before ordering.

・ *2: Industrialꢀproducts and Medical products

・ *3: For standard case size, please kindly refer to ④Dimension, ⑤Dimension tolerance,ꢀ⑨Thickness and STANDARD EXTERNAL DIMENSIONS.

Multilayer Ceramic Capacitors (High dielectric type)

●105TYPE (Demension:1.0×0.5mmꢀJIS:1005ꢀEIA:0402）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK105 BJ471[]VHF

UMK105 BJ102[]VHF

UMK105 BJ152[]VHF

UMK105 BJ222[]VHF

UMK105 BJ332[]VHF

UMK105 BJ472[]VHF

UMK105 BJ682[]VHF

UMK105 BJ103[]VHF

UMK105 BJ223[]VHF

UMK105 BJ473[]VHF

UMK105 BJ104[]VHF

TMK105 BJ472[]VHF

TMK105 BJ682[]VHF

TMK105 BJ103[]VHF

TMK105 BJ153[]VHF

TMK105 BJ223[]VHF

TMK105 BJ333[]VHF

TMK105 BJ473[]VHF

TMK105 BJ104[]VHF

TMK105 BJ224[]VHF

TMK105ABJ474[]VHF

EMK105 BJ103[]VHF

EMK105 BJ153[]VHF

EMK105 BJ223[]VHF

EMK105 BJ333[]VHF

EMK105 BJ473[]VHF

EMK105 BJ104[]VHF

EMK105 BJ224[]VHF

EMK105ABJ474[]VHF

EMK105 BJ105[]VHF

LMK105 BJ333[]VHF

LMK105 BJ473[]VHF

LMK105 BJ104[]VHF

LMK105 BJ224[]VHF

LMK105ABJ474[]VHF

LMK105 BJ105[]VHF

LMK105ABJ225[]VHF

JMK105 BJ104[]VHF

JMK105 BJ224[]VHF

JMK105 BJ474[]VHF

JMK105 BJ105[]VHF

JMK105 BJ225[]VHF

JMK105BBJ475MVHF

AMK105 BJ225[]VHF

AMK105BBJ475MVHF

AMK105CBJ106MVHF

X5R

470 p

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

±10, ±20

±20

2.5

3.5

200

150

200

150

200

150

200

150

0.5±0.05

0.5±0.10

0.5±0.05

0.5±0.10

0.5±0.05

0.5±0.10

0.5±0.05

0.5±0.10

0.5±0.05

0.5+0.15/-0.05

0.5±0.05

0.5+0.15/-0.05

0.5+0.20/-0

*1, *2

2.5

3.5

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.47 μ

1 μ

3.5

0.033 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

2.2 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

6.3

2.2 μ

4.7 μ

2.2 μ

±10, ±20

±20

4.7 μ

10 μ

±20

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK105 B7221[]VHF

UMK105 B7331[]VHF

UMK105 B7471[]VHF

UMK105 B7681[]VHF

UMK105 B7102[]VHF

UMK105 B7152[]VHF

UMK105 B7222[]VHF

UMK105 B7332[]VHF

UMK105 B7472[]VHF

UMK105 B7682[]VHF

UMK105 B7103[]VHF

UMK105 B7223[]VHF

UMK105 B7473[]VHF

UMK105 B7104[]VHF

TMK105 B7472[]VHF

TMK105 B7682[]VHF

TMK105 B7103[]VHF

TMK105 B7153[]VHF

TMK105 B7223[]VHF

TMK105 B7333[]VHF

TMK105 B7473[]VHF

TMK105 B7104[]VHF

EMK105 B7103[]VHF

EMK105 B7153[]VHF

EMK105 B7223[]VHF

EMK105 B7333[]VHF

EMK105 B7473[]VHF

EMK105 B7104[]VHF

EMK105 B7224[]VHF

LMK105 B7473[]VHF

LMK105 B7104[]VHF

LMK105 B7224[]VHF

JMK105 B7104[]VHF

JMK105 B7224[]VHF

JMK105 B7474[]VHF

AMK105 B7474[]VHF

X7R

220 p

330 p

±10, ±20

2.5

3.5

2.5

3.5

200

150

200

150

200

150

200

150

0.5±0.05

*1, *2

470 p

680 p

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

0.22 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.1 μ

6.3

0.22 μ

0.47 μ

●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK107 BJ104[]AHT

UMK107 BJ224[]AHT

UMK107 BJ474[]AHT

UMK107ABJ105[]AHT

GMK107 BJ223[]AHT

GMK107 BJ473[]AHT

GMK107 BJ104[]AHT

GMK107 BJ224[]AHT

GMK107ABJ474[]AHT

GMK107 BJ105[]AHT

TMK107 BJ223[]AHT

TMK107 BJ473[]AHT

TMK107 BJ104[]AHT

TMK107 BJ224[]AHT

TMK107 BJ474[]AHT

TMK107 BJ105[]AHT

TMK107BBJ225[]AHT

EMK107 BJ104[]AHT

EMK107 BJ224[]AHT

EMK107 BJ474[]AHT

EMK107 BJ105[]AHT

EMK107ABJ225[]AHT

EMK107BBJ475[]AHT

LMK107 BJ474[]AHT

LMK107 BJ105[]AHT

LMK107 BJ225[]AHT

LMK107 BJ475[]AHT

LMK107BBJ106MAHT

JMK107 BJ105[]AHT

JMK107 BJ225[]AHT

JMK107 BJ475[]AHT

JMK107ABJ106[]AHT

AMK107ABJ106[]AHT

AMK107BBJ226MAHT

X5R

0.1 μ

0.22 μ

0.47 μ

1 μ

±10, ±20

±20

3.5

2.5

3.5

2.5

3.5

150

200

150

200

150

0.8±0.10

*1, *2

0.8±0.10

0.8+0.15/-0.05

0.8±0.10

0.022 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.8±0.10

0.8+0.15/-0.05

0.8±0.10

0.022 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.8±0.10

3.5

0.8±0.10

2.2 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.8+0.20/-0

0.8±0.10

3.5

0.8±0.10

2.2 μ

4.7 μ

0.47 μ

1 μ

3.5

0.8+0.15/-0.05

0.8+0.20/-0

0.8±0.10

2.2 μ

4.7 μ

10 μ

0.8±0.10

0.8+0.20/-0

0.8±0.10

1 μ

±10, ±20

±20

2.2 μ

4.7 μ

10 μ

0.8±0.10

6.3

0.8±0.10

0.8+0.15/-0.05

0.8+0.20/-0

10 μ

22 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）, D7 : X7T（－55～＋125℃）】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK107 B7102[]AHT

UMK107 B7152[]AHT

UMK107 B7222[]AHT

UMK107 B7332[]AHT

UMK107 B7472[]AHT

UMK107 B7682[]AHT

UMK107 B7103[]AHT

UMK107 B7153[]AHT

UMK107 B7223[]AHT

UMK107 B7333[]AHT

UMK107 B7473[]AHT

UMK107 B7683[]AHT

UMK107 B7104[]AHT

UMK107 C7224[]AHTE

GMK107 B7473[]AHT

GMK107 B7104[]AHT

GMK107 B7224[]AHT

GMK107 B7474[]AHT

GMK107AB7105[]AHT

TMK107 B7223[]AHT

TMK107 B7473[]AHT

TMK107 B7104[]AHT

TMK107 B7224[]AHT

TMK107 B7474[]AHT

TMK107AB7105[]AHT

EMK107 B7473[]AHT

EMK107 B7104[]AHT

EMK107 B7224[]AHT

EMK107 B7474[]AHT

EMK107 B7105[]AHT

LMK107 B7224[]AHT

LMK107 B7474[]AHT

LMK107 B7105[]AHT

LMK107BD7225[]AHT

JMK107 B7105[]AHT

JMK107 B7225[]AHTR

X7R

X7S

X7R

X7T

X7R

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

3.5

200

150

200

150

200

150

200

150

200

150

200

150

0.8±0.10

0.8+0.15/-0.05

0.8±0.10

0.8+0.15/-0.05

0.8±0.10

0.8+0.20/-0

0.8±0.10

*1, *2

0.22 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.022 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

0.22 μ

0.47 μ

1 μ

3.5

2.2 μ

1 μ

6.3

2.2 μ

●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK212 BJ104[]GHT

UMK212 BJ224[]GHT

UMK212 BJ474[]GHT

UMK212 BJ105[]GHT

GMK212 BJ104[]GHT

GMK212 BJ224[]GHT

GMK212 BJ474[]GHT

GMK212 BJ105[]GHT

GMK212BBJ225[]GHT

TMK212 BJ104[]GHT

TMK212 BJ224[]GHT

TMK212 BJ474[]GHT

TMK212 BJ105[]GHT

TMK212 BJ225[]GHT

TMK212BBJ475[]GHT

TMK212BBJ106[]GHT

EMK212 BJ105[]GHT

EMK212 BJ225[]GHT

EMK212ABJ475[]GHT

EMK212BBJ106[]GHT

LMK212 BJ225[]GHT

LMK212ABJ475[]GHT

LMK212ABJ106[]GHT

JMK212ABJ475[]GHT

JMK212ABJ106[]GHT

JMK212BBJ226MGHT

AMK212ABJ226MGHT

AMK212BBJ476MGHT

X5R

0.1 μ

0.22 μ

0.47 μ

1 μ

±10, ±20

±20

3.5

200

150

200

150

200

150

200

150

200

150

200

150

1.25±0.10

*1, *2

1.25±0.10

0.1 μ

0.22 μ

0.47 μ

1 μ

3.5

1.25±0.10

2.2 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

3.5

1.25+0.20/-0

1.25±0.10

2.2 μ

4.7 μ

10 μ

1 μ

1.25±0.10

3.5

1.25+0.20/-0

1.25±0.10

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

4.7 μ

10 μ

22 μ

47 μ

1.25±0.10

1.25+0.15/-0.05

1.25+0.20/-0

1.25±0.10

1.25+0.15/-0.05

1.25+0.20/-0

1.25+0.15/-0.05

1.25+0.20/-0

6.3

±20

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.85mm thickness（D）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

EMK212 BJ105[]DHT

EMK212ABJ225[]DHT

EMK212BBJ475[]DHT

X5R

1 μ

2.2 μ

4.7 μ

±10, ±20

200

150

0.85±0.10

*1, *2

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK212 B7103[]GHT

UMK212 B7153[]GHT

UMK212 B7223[]GHT

UMK212 B7333[]GHT

UMK212 B7473[]GHT

UMK212 B7683[]GHT

UMK212 B7104[]GHT

UMK212 B7224[]GHT

UMK212 C7474[]GHTE

UMK212 B7105[]GHT

GMK212 B7224[]GHT

GMK212 B7105[]GHT

TMK212 B7224[]GHT

TMK212 B7334[]GHT

TMK212 B7474[]GHT

TMK212 B7105[]GHTR

TMK212 B7225[]GHT

EMK212 B7224[]GHT

EMK212 B7334[]GHT

EMK212 B7474[]GHT

EMK212 B7105[]GHTR

EMK212 B7225[]GHT

EMK212AB7475[]GHT

LMK212 B7105[]GHTR

LMK212 B7225[]GHT

LMK212 B7475[]GHT

JMK212 B7475[]GHT

JMK212AB7106[]GHT

X7R

X7S

X7R

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

±10, ±20

3.5

2.5

3.5

200

150

200

150

200

150

1.25±0.10

1.25+0.15/-0.05

1.25±0.10

1.25+0.15/-0.05

*1, *2

0.22 μ

1 μ

3.5

0.22 μ

0.33 μ

0.47 μ

1 μ

3.5

2.2 μ

0.22 μ

0.33 μ

0.47 μ

1 μ

3.5

2.2 μ

4.7 μ

1 μ

2.2 μ

4.7 μ

10 μ

6.3

●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK316 BJ474[]LHT

UMK316 BJ105[]LHT

UMK316 BJ225[]LHT

UMK316ABJ475[]LHT

GMK316 BJ105[]LHT

GMK316 BJ225[]LHT

GMK316 BJ475[]LHT

GMK316BBJ106[]LHT

TMK316 BJ225[]LHT

TMK316 BJ475[]LHT

TMK316 BJ106[]LHT

EMK316 BJ225[]LHT

EMK316 BJ475[]LHT

EMK316 BJ106[]LHT

EMK316BBJ226MLHT

LMK316 BJ475[]LHT

LMK316 BJ106[]LHT

LMK316ABJ226[]ＬHT

JMK316 BJ106[]LHT

JMK316ABJ226[]LHT

JMK316ABJ476MLHT

JMK316BBJ107MLHT

AMK316ABJ107MLHT

X5R

0.47 μ

1 μ

±10, ±20

±20

3.5

200

150

200

150

200

150

200

150

200

150

1.6±0.20

1.6±0.30

1.6±0.20

1.6±0.30

1.6±0.20

1.6±0.30

1.6±0.20

*1, *2

2.2 μ

4.7 μ

1 μ

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

4.7 μ

10 μ

22 μ

10 μ

22 μ

47 μ

100 μ

3.5

±10, ±20

±20

6.3

±20

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK316 B7473[]LHT

UMK316 B7683[]LHT

UMK316 B7104[]LHT

UMK316 B7154[]LHT

UMK316 B7224[]LHT

UMK316 B7334[]LHT

UMK316 B7474[]LHT

UMK316 B7105[]LHT

UMK316 B7225[]LHT

UMK316AC7475[]LHTE

GMK316 B7105[]LHT

GMK316 B7225[]LHT

GMK316AB7475[]LHT

TMK316 B7105[]LHT

TMK316 B7225[]LHT

TMK316AB7475[]LHT

TMK316AB7106[]LHT

EMK316 B7225[]LHT

EMK316AB7475[]LHT

EMK316AB7106[]LHT

LMK316 B7475[]LHT

LMK316AB7106[]LHT

JMK316AB7106[]LHT

JMK316AB7226[]LHT

AMK316AB7226[]LHT

AMK316AC7476MLHT

X7R

X7S

X7R

X7S

0.047 μ

0.068 μ

0.1 μ

0.15 μ

0.22 μ

0.33 μ

0.47 μ

1 μ

±10, ±20

±20

3.5

2.5

3.5

2.5

3.5

200

150

200

150

200

150

200

150

1.6±0.20

*1, *2

2.2 μ

4.7 μ

1 μ

2.2 μ

4.7 μ

1 μ

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

4.7 μ

10 μ

22 μ

47 μ

6.3

●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK325 BJ106[]MHP

GMK325 BJ106[]MHP

TMK325 BJ106[]MHP

EMK325 BJ226[]MHP

EMK325ABJ476[]MHP

LMK325 BJ226[]MHP

LMK325 BJ476[]MHP

LMK325ABJ107MMHP

JMK325 BJ476[]MHP

JMK325ABJ107MMHP

AMK325ABJ107MMHP

AMK325ABJ227MMHP

X5R

10 μ

22 μ

47 μ

22 μ

47 μ

100 μ

47 μ

100 μ

220 μ

±10, ±20

±20

150

2.5±0.20

2.5±0.30

2.5±0.20

2.5±0.30

2.5±0.20

2.5±0.30

*1, *2

±10, ±20

±20

*1, *2

6.3

±20

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ1.9mm thickness（N）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK325 BJ475[]NHT

GMK325 BJ225MNHT

GMK325 BJ475[]NHT

TMK325 BJ475[]NHT

EMK325 BJ475MNHT

EMK325 BJ106[]NHT

X5R

4.7 μ

2.2 μ

4.7 μ

10 μ

±10, ±20

±20

3.5

150

200

150

200

150

1.9±0.20

*1, *2

±10, ±20

±20

±10, ±20

【Temperature Characteristic C6 : X6S（－55～＋105℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

2.5±0.30

Part number 1

Part number 2

Note

Rated voltage x ％

150

JMK325AC6107MMHP

6.3

X6S

100 μ

±20

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK325 B7225[]MHP

UMK325 B7335[]MHP

UMK325 B7475[]MHP

UMK325AB7106[]MHP

GMK325AB7106[]MHP

TMK325 B7335[]MHP

TMK325AB7106[]MHPR

TMK325 B7226[]MHP

EMK325 B7226[]MHP

LMK325 B7226[]MHP

JMK325 B7226[]MHPR

JMK325 B7476[]MHPR

X7R

2.2 μ

3.3 μ

4.7 μ

10 μ

3.3 μ

10 μ

22 μ

47 μ

±10, ±20

3.5

200

150

200

150

2.5±0.20

2.5±0.30

2.5±0.20

2.5±0.30

2.5±0.20

*1, *2

3.5

6.3

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.9mm thickness（N）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMK325 B7105[]NHT

GMK325 B7225[]NHT

GMK325 B7475[]NHTR

TMK325 B7475[]NHT

EMK325 B7475[]NHT

EMK325 B7106[]NHTR

X7R

1 μ

2.2 μ

4.7 μ

10 μ

±10, ±20

3.5

200

150

1.9±0.20

*1, *2

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Multilayer Ceramic Capacitors （Temperature compensating type）

●063TYPE (Dimension:0.6×0.3mmꢀJIS:0603ꢀEIA:0201）

【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】ꢀ0.3mm thickness（T）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance

Thickness^*3[mm]

Part number 1

Part number 2

［at 1MHz］

(Min)

Note

Rated voltage x ％

UMK063 CG0R5CTHF

UMK063 CG010CTHF

UMK063 CG1R5CTHF

UMK063 CG020CTHF

UMK063 CG030CTHF

UMK063 CG040CTHF

UMK063 CG050CTHF

UMK063 CG060DTHF

UMK063 CG070DTHF

UMK063 CG080DTHF

UMK063 CG090DTHF

UMK063 CG100DTHF

UMK063 CG120JTHF

UMK063 CG150JTHF

UMK063 CG180JTHF

UMK063 CG220JTHF

UMK063 CG270JTHF

UMK063 CG330JTHF

UMK063 CG390JTHF

UMK063 CG470JTHF

UMK063 CG560JTHF

UMK063 CG680JTHF

UMK063 CG820JTHF

UMK063 CG101JTHF

TMK063 CG121JTHF

TMK063 CG151JTHF

TMK063 CG181JTHF

TMK063 CG221JTHF

C0G

0.5 p

1 p

±0.25pF

±0.5pF

±5％

410

420

200

0.3±0.03

*1, *2

1.5 p

2 p

430

440

3 p

460

4 p

480

5 p

500

6 p

520

7 p

540

8 p

560

9 p

580

10 p

12 p

15 p

18 p

22 p

27 p

33 p

39 p

47 p

56 p

68 p

82 p

100 p

120 p

150 p

180 p

220 p

600

640

±5％

700

±5％

760

±5％

840

±5％

940

±5％

1000

±5％

●105TYPE (Dimension:1.0×0.5mmꢀJIS:1005ꢀEIA:0402）

【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance

Thickness^*3[mm]

Part number 1

Part number 2

［at 1MHz］

(Min)

Note

Rated voltage x ％

UMK105 CG0R5CVHF

UMK105 CG010CVHF

UMK105 CG1R5CVHF

UMK105 CG020CVHF

UMK105 CG030CVHF

UMK105 CG040CVHF

UMK105 CG050CVHF

UMK105 CG060DVHF

UMK105 CG070DVHF

UMK105 CG080DVHF

UMK105 CG090DVHF

UMK105 CG100DVHF

UMK105 CG120JVHF

UMK105 CG150JVHF

UMK105 CG180JVHF

UMK105 CG220JVHF

UMK105 CG270JVHF

UMK105 CG330JVHF

UMK105 CG390JVHF

UMK105 CG470JVHF

UMK105 CG560JVHF

UMK105 CG680JVHF

UMK105 CG820JVHF

UMK105 CG101JVHF

UMK105 CG121JVHF

UMK105 CG151JVHF

UMK105 CG181JVHF

UMK105 CG221JVHF

UMK105 CG271JVHF

UMK105 CG331JVHF

UMK105 CG391JVHF

UMK105 CG471JVHF

UMK105 CG561JVHF

UMK105 CG681JVHF

UMK105 CG821JVHF

UMK105 CG102JVHF

C0G

0.5 p

1 p

±0.25pF

±0.5pF

±5％

410

420

200

0.5±0.05

*1, *2

1.5 p

2 p

430

440

3 p

460

4 p

480

5 p

500

6 p

520

7 p

540

8 p

560

9 p

580

10 p

12 p

15 p

18 p

22 p

27 p

33 p

39 p

47 p

56 p

68 p

82 p

100 p

120 p

150 p

180 p

220 p

270 p

330 p

390 p

470 p

560 p

680 p

820 p

1000 p

600

640

±5％

700

±5％

760

±5％

840

±5％

940

±5％

1000

±5％

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Medium-High Voltage Multilayer Ceramic Capacitors

●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK107 B7102[]AHT

HMK107 B7152[]AHT

HMK107 B7222[]AHT

HMK107 B7332[]AHT

HMK107 B7472[]AHT

HMK107 B7682[]AHT

HMK107 B7103[]AHT

HMK107 B7153[]AHT

HMK107 B7223[]AHT

HMK107 B7333[]AHT

HMK107 B7473[]AHT

HMK107 B7104[]AHT

HMK107 C7224[]AHTE

X7R

X7S

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

±10, ±20

3.5

200

150

0.8±0.10

*1, *2

100

0.22 μ

●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK212 B7472[]GHT

HMK212 B7682[]GHT

HMK212 B7103[]GHT

HMK212 B7153[]GHT

HMK212 B7223[]GHT

HMK212 B7333[]GHT

HMK212 B7473[]GHT

HMK212 B7683[]GHT

HMK212 B7104[]GHT

HMK212 B7224[]GHT

HMK212 C7474[]GHTE

HMK212BC7105[]GHTE

QMK212 B7472[]GHT

QMK212 B7682[]GHT

QMK212 B7103[]GHT

QMK212 B7153[]GHT

QMK212 B7223[]GHT

X7R

X7S

X7R

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

±10, ±20

2.5

3.5

2.5

200

150

1.25±0.10

1.25+0.20/-0

1.25±0.10

*1, *2

100

0.22 μ

0.47 μ

1 μ

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

250

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.85mm thickness（D）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK212 B7102[]DHT

HMK212 B7152[]DHT

HMK212 B7222[]DHT

HMK212 B7332[]DHT

QMK212 B7102[]DHT

QMK212 B7152[]DHT

QMK212 B7222[]DHT

QMK212 B7332[]DHT

X7R

1000 p

1500 p

2200 p

3300 p

1000 p

1500 p

2200 p

3300 p

±10, ±20

2.5

200

150

0.85±0.10

*1, *2

100

250

●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK316 B7473[]LHT

HMK316 B7683[]LHT

HMK316 B7104[]LHT

HMK316 B7154[]LHT

HMK316 B7224[]LHT

HMK316 B7334[]LHT

HMK316 B7474[]LHT

HMK316 B7105[]LHT

HMK316AC7225[]LHTE

QMK316 B7223[]LHT

QMK316 B7333[]LHT

QMK316 B7473[]LHT

QMK316 B7683[]LHT

QMK316 B7104[]LHT

SMK316 B7153[]LHT

SMK316 B7223[]LHT

X7R

X7S

X7R

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

120

1.6±0.20

*1, *2

0.15 μ

0.22 μ

0.33 μ

0.47 μ

1 μ

100

2.2 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

250

630

0.015 μ

0.022 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.15mm thickness（F）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

SMK316 B7102[]FHT

SMK316 B7152[]FHT

SMK316 B7222[]FHT

SMK316 B7332[]FHT

SMK316 B7472[]FHT

SMK316 B7682[]FHT

SMK316 B7103[]FHT

X7R

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

±10, ±20

2.5

120

1.15±0.10

*1, *2

630

●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK325 B7225[]MHP

HMK325 C7475[]MHPE

X7R

X7S

2.2 μ

4.7 μ

±10, ±20

3.5

200

150

2.5±0.20

*1, *2

100

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.9mm thickness（N）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK325 B7224[]NHT

HMK325 B7474[]NHT

HMK325 B7684[]NHT

HMK325 B7105[]NHT

QMK325 B7473[]NHT

QMK325 B7104[]NHT

QMK325 B7154[]NHT

QMK325 B7224[]NHT

SMK325 B7223[]NHT

SMK325 B7333[]NHT

SMK325 B7473[]NHT

X7R

0.22 μ

0.47 μ

0.68 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

1.9±0.20

*1, *2

100

0.047 μ

0.1 μ

250

630

0.15 μ

0.22 μ

0.022 μ

0.033 μ

0.047 μ

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.15mm thickness（F）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

1.15±0.10

Part number 1

Part number 2

Note

Rated voltage x ％

200

HMK325 B7104[]FHT

100

X7R

0.1 μ

±10, ±20

3.5

*1, *2

●432TYPE (Dimension:4.5×3.2mmꢀJIS:4532ꢀEIA:1812）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMK432 B7474[]MHT

HMK432 B7105[]MHT

HMK432 B7155[]MHT

HMK432 B7225[]MHT

QMK432 B7104[]MHT

QMK432 B7224[]MHT

QMK432 B7334[]MHT

QMK432 B7474[]MHT

SMK432 B7473[]MHT

SMK432 B7683[]MHT

SMK432 B7104[]MHT

X7R

0.47 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

2.5±0.20

*1, *2

100

1.5 μ

2.2 μ

0.1 μ

0.22 μ

0.33 μ

0.47 μ

0.047 μ

0.068 μ

0.1 μ

250

630

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Medium-High Voltage Multilayer Ceramic Capacitors for High Frequency Applications

●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】ꢀ0.7mm thickness（C）

［at 1MHz］

(Min)

804

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance

Thickness^*3

Part number 1

Note

Part number 2

[mm]

Rated voltage x ％

QVS107 CG0R2[]CHT

QVS107 CG0R3[]CHT

QVS107 CG0R4[]CHT

QVS107 CG0R5[]CHT

QVS107 CG0R6[]CHT

QVS107 CG0R7[]CHT

QVS107 CGR75[]CHT

QVS107 CG0R8[]CHT

QVS107 CG0R9[]CHT

QVS107 CG010[]CHT

QVS107 CG1R1[]CHT

QVS107 CG1R2[]CHT

QVS107 CG1R3[]CHT

QVS107 CG1R5[]CHT

QVS107 CG1R6[]CHT

QVS107 CG1R8[]CHT

QVS107 CG020[]CHT

QVS107 CG2R2[]CHT

QVS107 CG2R4[]CHT

QVS107 CG2R7[]CHT

QVS107 CG030[]CHT

QVS107 CG3R3[]CHT

QVS107 CG3R6[]CHT

QVS107 CG3R9[]CHT

QVS107 CG4R3[]CHT

QVS107 CG4R7[]CHT

QVS107 CG5R1[]CHT

QVS107 CG5R6[]CHT

QVS107 CG6R2[]CHT

QVS107 CG6R8[]CHT

QVS107 CG7R5[]CHT

QVS107 CG8R2[]CHT

QVS107 CG9R1[]CHT

QVS107 CG100[]CHT

QVS107 CG110JCHT

QVS107 CG120JCHT

QVS107 CG130JCHT

QVS107 CG150JCHT

QVS107 CG160JCHT

QVS107 CG180JCHT

QVS107 CG200JCHT

QVS107 CG220JCHT

QVS107 CG240JCHT

QVS107 CG270JCHT

QVS107 CG300JCHT

QVS107 CG330JCHT

QVS107 CG360JCHT

QVS107 CG390JCHT

QVS107 CG430JCHT

QVS107 CG470JCHT

QVS107 CG510JCHT

QVS107 CG560JCHT

QVS107 CG620JCHT

QVS107 CG680JCHT

QVS107 CG750JCHT

QVS107 CG820JCHT

QVS107 CG910JCHT

QVS107 CG101JCHT

C0G

0.2 p

0.3 p

0.4 p

0.5 p

0.6 p

0.7 p

0.75 p

0.8 p

0.9 p

1 p

±0.05pF, ±0.1pF

±0.1pF, ±0.25pF

±0.25pF, ±0.5pF

±2％, ±5％

±5％

200

0.7±0.10

*1, *2

806

808

810

812

814

815

816

818

820

1.1 p

1.2 p

1.3 p

1.5 p

1.6 p

1.8 p

2 p

822

824

826

830

832

836

840

2.2 p

2.4 p

2.7 p

3 p

844

848

854

860

3.3 p

3.6 p

3.9 p

4.3 p

4.7 p

5.1 p

5.6 p

6.2 p

6.8 p

7.5 p

8.2 p

9.1 p

10 p

11 p

12 p

13 p

15 p

16 p

18 p

20 p

22 p

24 p

27 p

30 p

33 p

36 p

39 p

43 p

47 p

51 p

56 p

62 p

68 p

75 p

82 p

91 p

100 p

866

872

878

886

894

902

912

924

250

936

950

964

982

1000

1020

1040

1060

1100

1120

1160

1200

1240

1280

1340

1400

±5％

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.85mm thickness（D）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance

Thickness^*3[mm]

Part number 1

Part number 2

［at 1MHz］

(Min)

Note

Rated voltage x ％

QVS212 CG0R3[]DHT

QVS212 CG0R4[]DHT

QVS212 CG0R5[]DHT

QVS212 CG0R6[]DHT

QVS212 CG0R7[]DHT

QVS212 CGR75[]DHT

QVS212 CG0R8[]DHT

QVS212 CG0R9[]DHT

QVS212 CG010[]DHT

QVS212 CG1R1[]DHT

QVS212 CG1R2[]DHT

QVS212 CG1R3[]DHT

QVS212 CG1R5[]DHT

QVS212 CG1R6[]DHT

QVS212 CG1R8[]DHT

QVS212 CG020[]DHT

QVS212 CG2R2[]DHT

QVS212 CG2R4[]DHT

QVS212 CG2R7[]DHT

QVS212 CG030[]DHT

QVS212 CG3R3[]DHT

QVS212 CG3R6[]DHT

QVS212 CG3R9[]DHT

QVS212 CG4R3[]DHT

QVS212 CG4R7[]DHT

QVS212 CG5R1[]DHT

QVS212 CG5R6[]DHT

QVS212 CG6R2[]DHT

QVS212 CG6R8[]DHT

QVS212 CG7R5[]DHT

QVS212 CG8R2[]DHT

QVS212 CG9R1[]DHT

QVS212 CG100JDHT

QVS212 CG110JDHT

QVS212 CG120JDHT

QVS212 CG130JDHT

QVS212 CG150JDHT

QVS212 CG160JDHT

QVS212 CG180JDHT

QVS212 CG200JDHT

QVS212 CG220JDHT

QVS212 CG240JDHT

QVS212 CG270JDHT

QVS212 CG300JDHT

QVS212 CG330JDHT

QVS212 CG360JDHT

QVS212 CG390JDHT

QVS212 CG430JDHT

QVS212 CG470JDHT

QVS212 CG510JDHT

QVS212 CG560JDHT

QVS212 CG620JDHT

QVS212 CG680JDHT

QVS212 CG750JDHT

QVS212 CG820JDHT

QVS212 CG910JDHT

QVS212 CG101JDHT

C0G

0.3 p

0.4 p

0.5 p

0.6 p

0.7 p

0.75 p

0.8 p

0.9 p

1 p

±0.1pF, ±0.25pF

±0.25pF, ±0.5pF

±5％

806

808

200

0.85±0.10

*1, *2

810

812

814

815

816

818

820

1.1 p

1.2 p

1.3 p

1.5 p

1.6 p

1.8 p

2 p

822

824

826

830

832

836

840

2.2 p

2.4 p

2.7 p

3 p

844

848

854

860

3.3 p

3.6 p

3.9 p

4.3 p

4.7 p

5.1 p

5.6 p

6.2 p

6.8 p

7.5 p

8.2 p

9.1 p

10 p

11 p

12 p

13 p

15 p

16 p

18 p

20 p

22 p

24 p

27 p

30 p

33 p

36 p

39 p

43 p

47 p

51 p

56 p

62 p

68 p

75 p

82 p

91 p

100 p

866

872

878

886

894

902

912

924

250

936

950

964

982

1000

1020

1040

1060

1100

1120

1160

1200

1240

1280

1340

1400

±5％

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

Soft Termination Multilayer Ceramic Capacitors

●107TYPEꢀ (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

TMJ107BB7473[]AHT

TMJ107BB7104[]AHT

TMJ107BB7224[]AHT

TMJ107BB7474[]AHT

TMJ107CB7105[]AHR

GMJ107BB7473[]AHT

GMJ107BB7104[]AHT

GMJ107BB7224[]AHT

GMJ107BB7474[]AHT

GMJ107CB7105[]AHR

UMJ107AB7102[]AHT

UMJ107AB7222[]AHT

UMJ107BB7472[]AHT

UMJ107BB7103[]AHT

UMJ107BB7223[]AHT

UMJ107BB7473[]AHT

UMJ107BB7104[]AHT

HMJ107AB7102[]AHT

HMJ107AB7222[]AHT

HMJ107BB7472[]AHT

HMJ107BB7103[]AHT

HMJ107BB7223[]AHT

HMJ107BB7473[]AHT

HMJ107BB7104[]AHT

X7R

0.047 μ

0.1 μ

±10, ±20

3.5

200

150

200

150

200

0.8+0.20/-0

0.8+0.25/-0

0.8+0.20/-0

0.8+0.25/-0

0.8+0.15/-0.05

0.8+0.20/-0

0.8+0.15/-0.05

0.8+0.20/-0

*1, *2

0.22 μ

0.47 μ

1 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.47 μ

1 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

100

●212TYPEꢀ(Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ0.85mm thickness（D）、1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

JMJ212CB7106[]GHT

EMJ212CB7225[]GHT

EMJ212CB7475[]GHT

TMJ212CB7225[]GHT

GMJ212CB7105[]GHT

UMJ212BB7103[]GHT

UMJ212BB7223[]GHT

UMJ212BB7473[]GHT

UMJ212BB7104[]GHT

UMJ212BB7224[]GHT

UMJ212CC7474[]GHTE

UMJ212CB7105[]GHT

HMJ212KB7102[]DHT

HMJ212KB7222[]DHT

HMJ212BB7472[]GHT

HMJ212BB7103[]GHT

HMJ212BB7223[]GHT

HMJ212BB7473[]GHT

HMJ212BB7104[]GHT

HMJ212BB7224[]GHT

HMJ212CC7474[]GHTE

QMJ212KB7102[]DHT

QMJ212KB7222[]DHT

QMJ212BB7472[]GHT

QMJ212BB7103[]GHT

QMJ212BB7223[]GHT

6.3

X7R

X7S

X7R

X7S

X7R

10 μ

2.2 μ

±10, ±20

150

200

150

200

150

1.25+0.25/-0

1.25+0.20/-0

1.25+0.25/-0

0.85±0.15

*1, *2

4.7 μ

2.2 μ

1 μ

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.47 μ

1 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

2.5

0.85±0.15

1.25+0.20/-0

1.25+0.25/-0

0.85±0.15

100

250

0.22 μ

0.47 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.85±0.15

1.25+0.20/-0

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ1.15mm thickness（F）、1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

LMJ316BB7226[]LHT

EMJ316BB7475[]LHT

EMJ316BB7106[]LHT

TMJ316BB7474[]LHT

TMJ316BB7475[]LHT

TMJ316BB7106[]LHT

GMJ316BB7474[]LHT

GMJ316AB7225[]LHT

GMJ316BB7475[]LHT

GMJ316BB7106[]LHT

UMJ316BB7473[]LHT

UMJ316BB7104[]LHT

UMJ316BB7224[]LHT

UMJ316BB7474[]LHT

UMJ316BB7105[]LHT

UMJ316AB7225[]LHT

UMJ316BC7475[]LHTE

HMJ316 B7102[]FHT

HMJ316 B7222[]FHT

HMJ316 B7472[]FHT

HMJ316KB7103[]FHT

HMJ316BB7223[]LHT

HMJ316BB7473[]LHT

HMJ316BB7104[]LHT

HMJ316BB7224[]LHT

HMJ316BB7474[]LHT

HMJ316BB7105[]LHT

HMJ316BC7225[]LHTE

QMJ316 B7102[]FHT

QMJ316 B7222[]FHT

QMJ316 B7472[]FHT

QMJ316KB7103[]FHT

QMJ316BB7223[]LHT

QMJ316BB7473[]LHT

QMJ316BB7104[]LHT

SMJ316 B7102[]FHT

SMJ316 B7222[]FHT

SMJ316 B7472[]FHT

SMJ316KB7103[]FHT

SMJ316BB7223[]LHT

X7R

X7S

X7R

X7S

X7R

22 μ

4.7 μ

±10, ±20

150

200

150

200

150

200

150

200

150

120

1.6±0.30

1.6±0.20

1.6±0.30

1.6±0.20

1.6±0.30

1.15±0.10

1.15±0.20

1.6±0.30

1.15±0.10

1.15±0.20

1.6±0.30

1.15±0.10

1.15±0.20

1.6±0.30

*1, *2

10 μ

0.47 μ

4.7 μ

3.5

10 μ

0.47 μ

2.2 μ

3.5

4.7 μ

10 μ

0.047 μ

0.1 μ

3.5

0.22 μ

0.47 μ

1 μ

2.2 μ

4.7 μ

2.5

3.5

2.5

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

100

0.22 μ

0.47 μ

1 μ

2.2 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

250

630

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】ꢀ1.9mm thickness（N）、2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

JMJ325KB7476[]MHP

EMJ325KB7226[]MHP

TMJ325AB7475[]MHP

TMJ325KB7106[]MHP

GMJ325AB7475[]MHP

GMJ325KB7106[]MHP

UMJ325AB7225[]MHP

UMJ325AB7475[]MHP

UMJ325KB7106[]MHP

HMJ325 B7223[]NHT

HMJ325 B7473[]NHT

HMJ325 B7104[]NHT

HMJ325 B7224[]NHT

HMJ325 B7474[]NHT

HMJ325 B7105[]NHT

HMJ325AB7225[]MHP

HMJ325KC7475[]MHPE

QMJ325 B7223[]NHT

QMJ325 B7473[]NHT

QMJ325 B7104[]NHT

QMJ325 B7224[]NHT

SMJ325 B7223[]NHT

SMJ325 B7473[]NHT

6.3

X7R

X7S

X7R

47 μ

22 μ

±10, ±20

150

200

150

200

150

120

2.5±0.30

1.9±0.20

2.5±0.30

1.9±0.20

*1, *2

4.7 μ

10 μ

4.7 μ

10 μ

3.5

2.2 μ

4.7 μ

10 μ

3.5

2.5

0.022 μ

0.047 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

100

2.2 μ

4.7 μ

0.022 μ

0.047 μ

0.1 μ

250

630

0.22 μ

0.022 μ

0.047 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

LW Reversal Decoupling Capacitors (LWDC^TM

)

●105TYPE (Dimension:0.52×1.0mmꢀJIS:0510ꢀEIA:0204）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.3mm thickness（P）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

TWK105 BJ104MPHF

EWK105 BJ224MPHF

LWK105 BJ474MPHF

AWK105 BJ105MPHF

X5R

0.1 μ

0.22 μ

0.47 μ

1 μ

±20

150

0.3±0.05

*1, *2

【Temperature Characteristic C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃】ꢀ0.3mm thickness（P）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

EWK105 C6104MPHF

LWK105 C7104MPHF

LWK105 C6224MPHF

JWK105 C7104MPHF

JWK105 C7224MPHF

JWK105 C6474MPHF

AWK105 C7224MPHF

AWK105 C6474MPHF

X6S

X7S

X6S

X7S

X6S

X7S

X6S

0.1 μ

±20

150

0.3±0.05

*1, *2

0.22 μ

0.1 μ

6.3

0.22 μ

0.47 μ

0.22 μ

0.47 μ

●107TYPE (Dimension:0.8×1.6mmꢀJIS:0816ꢀEIA:0306）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

LWK107 BJ105MVHT

JWK107 BJ225MVHT

JWK107 BJ475MVHT

X5R

1 μ

2.2 μ

4.7 μ

±20

150

0.5±0.05

*1, *2

6.3

【Temperature Characteristic B7 : X7R（－55～＋125℃）, C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

TWK107 B7104MVHT

EWK107 B7224MVHT

EWK107 B7474MVHT

LWK107 B7474MVHT

JWK107 C7105MVHT

AWK107 C6225MVHT

AWK107 C6475MVHT

X7R

X7S

X6S

0.1 μ

0.22 μ

0.47 μ

1 μ

±20

150

0.5±0.05

*1, *2

6.3

2.2 μ

4.7 μ

●212TYPE (Dimension:1.25×2.0mmꢀJIS:1220ꢀEIA:0508）

【Temperature Characteristic BJ : X5R（－55～＋85℃）】ꢀ0.85mm thickness（D）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

LWK212 BJ475[]DHT

JWK212 BJ106MDHT

AWK212 BJ226MDHT

6.3

X5R

4.7 μ

10 μ

22 μ

±10, ±20

±20

150

0.85±0.10

*1, *2

±20

【Temperature Characteristic C6 : X6S（－55～＋105℃）】ꢀ0.85mm thickness（D）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

0.85±0.10

Part number 1

Part number 2

Note

Rated voltage x ％

150

JWK212 C6475[]DHT

6.3

X6S

4.7 μ

±10, ±20

*1, *2

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

・ All the Multilayer Ceramic Capacitors of the catalog lineup are RoHS compliant.

・ Capacitance tolerance code is applied to [] of part number.

・ All the Multilayer Ceramic Capacitors in the catalog lineup are applicable for reflow-soldering.

Note)

・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels.

・ *1: Automotive (AEC-Q200 Qualified) products for POWERTRAIN, and SAFETY. Please check ”Automotive Application Guide” for further details before using the products.

ꢀꢀ＜ꢀꢀꢀꢀꢀꢀꢀꢀꢀ：AEC-Q200 qualified＞

AEC-Q200

ꢀꢀꢀꢀꢀAll the Multilayer Ceramic Capacitors ofꢀ*1 marks are tested based on the test conditions and methods defined in AEC-Q200 family item.

ꢀꢀꢀꢀꢀ125℃ꢀproducts：ꢀAEC-Q200ꢀGrade1 (we conduct the evaluation at the test condition of Grade1.)

ꢀꢀꢀꢀꢀPlease consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc.,

ꢀꢀꢀꢀꢀand please review andꢀapprove TAIYO YUDEN's product specification before ordering.

・ *3: For standard case size, please kindly refer to ④Dimension, ⑤Dimension tolerance,ꢀ⑨Thickness and STANDARD EXTERNAL DIMENSIONS.

High Reliability Application Multilayer Ceramic Capacitors

●105TYPE (Demension:1.0×0.5mmꢀJIS:1005ꢀEIA:0402）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.5mm thickness（V）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMF105 B7102[]VHF

UMF105 B7222[]VHF

UMF105 B7472[]VHF

UMF105 B7103[]VHF

TMF105 B7102[]VHF

TMF105 B7222[]VHF

TMF105 B7472[]VHF

TMF105 B7103[]VHF

TMF105 B7223[]VHF

TMF105 B7473[]VHF

EMF105 B7102[]VHF

EMF105 B7222[]VHF

EMF105 B7472[]VHF

EMF105 B7103[]VHF

EMF105 B7223[]VHF

EMF105 B7473[]VHF

EMF105 B7104[]VHF

LMF105 B7102[]VHF

LMF105 B7222[]VHF

LMF105 B7472[]VHF

LMF105 B7103[]VHF

LMF105 B7223[]VHF

LMF105 B7473[]VHF

LMF105 B7104[]VHF

X7R

1000 p

2200 p

4700 p

0.01 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

±10, ±20

2.5

3.5

2.5

3.5

2.5

3.5

200

150

200

150

200

150

200

0.5±0.05

1000 p

2200 p

4700 p

0.01 μ

0.022 μ

0.047 μ

0.1 μ

2.5

3.5

●107TYPE (Dimension:1.6×0.8mmꢀJIS:1608ꢀEIA:0603）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.8mm thickness（A）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

UMF107 B7223[]AHT

UMF107 B7104[]AHT

TMF107 B7223[]AHT

TMF107 B7104[]AHT

EMF107 B7223[]AHT

EMF107 B7104[]AHT

EMF107 B7105[]AHT

LMF107 B7223[]AHT

LMF107 B7104[]AHT

LMF107 B7105[]AHT

X7R

0.022 μ

0.1 μ

±10, ±20

3.5

200

150

200

150

0.8±0.10

0.022 μ

0.1 μ

0.022 μ

0.1 μ

1 μ

0.022 μ

0.1 μ

3.5

1 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

●212TYPE (Dimension:2.0×1.25mmꢀJIS:2012ꢀEIA:0805）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.25mm thickness（G）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMF212 B7103[]GHT

HMF212 B7223[]GHT

UMF212 B7103[]GHT

UMF212 B7223[]GHT

UMF212 B7473[]GHT

UMF212 B7104[]GHT

UMF212 B7224[]GHT

UMF212 B7105[]GHT

TMF212 B7103[]GHT

TMF212 B7223[]GHT

TMF212 B7473[]GHT

TMF212 B7104[]GHT

TMF212 B7224[]GHT

TMF212 B7105[]GHT

EMF212 B7473[]GHT

EMF212 B7104[]GHT

EMF212 B7224[]GHT

EMF212 B7105[]GHT

EMF212AB7475[]GHT

LMF212 B7473[]GHT

LMF212 B7104[]GHT

LMF212 B7224[]GHT

LMF212 B7105[]GHT

LMF212 B7475[]GHT

X7R

0.01 μ

0.022 μ

0.01 μ

0.022 μ

0.047 μ

0.1 μ

±10, ±20

3.5

200

150

200

150

200

150

1.25±0.10

1.25+0.15/-0.05

1.25±0.10

100

0.22 μ

1 μ

0.01 μ

0.022 μ

0.047 μ

0.1 μ

3.5

0.22 μ

1 μ

0.047 μ

0.1 μ

3.5

0.22 μ

1 μ

4.7 μ

0.047 μ

0.1 μ

3.5

0.22 μ

1 μ

4.7 μ

●316TYPE (Dimension:3.2×1.6mmꢀJIS:3216ꢀEIA:1206）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.15mm thickness（F）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMF316 B7102[]FHT

HMF316 B7222[]FHT

HMF316 B7472[]FHT

HMF316 B7103[]FHT

UMF316 B7102[]FHT

UMF316 B7222[]FHT

UMF316 B7472[]FHT

UMF316 B7103[]FHT

X7R

1000 p

2200 p

4700 p

0.01 μ

1000 p

2200 p

4700 p

0.01 μ

±10, ±20

2.5

200

1.15±0.10

100

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.6mm thickness（L）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMF316 B7104[]LHT

UMF316 B7104[]LHT

UMF316 B7105[]LHT

TMF316 B7104[]LHT

TMF316AB7475[]LHT

EMF316AB7106[]LHT

JMF316AB7106[]LHT

100

X7R

0.1 μ

1 μ

±10, ±20

3.5

200

150

200

150

200

1.6±0.20

0.1 μ

4.7 μ

10 μ

6.3

●325TYPE (Dimension:3.2×2.5mmꢀJIS:3225ꢀEIA:1210）

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ2.5mm thickness（M）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMF325 B7225[]MHP

UMF325 B7225[]MHP

UMF325 B7475[]MHP

TMF325 B7225[]MHP

TMF325 B7475[]MHP

EMF325 B7225[]MHP

EMF325 B7475[]MHP

LMF325 B7225[]MHP

LMF325 B7475[]MHP

100

X7R

2.2 μ

4.7 μ

2.2 μ

4.7 μ

2.2 μ

4.7 μ

2.2 μ

4.7 μ

±10, ±20

3.5

150

200

150

200

2.5±0.20

3.5

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

■PART NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.9mm thickness（N）

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Note

Rated voltage x ％

HMF325 B7223[]NHT

HMF325 B7473[]NHT

UMF325 B7223[]NHT

UMF325 B7473[]NHT

UMF325 B7104[]NHT

UMF325 B7224[]NHT

UMF325 B7474[]NHT

UMF325 B7105[]NHT

TMF325 B7224[]NHT

TMF325 B7474[]NHT

TMF325 B7105[]NHT

EMF325 B7224[]NHT

EMF325 B7474[]NHT

EMF325 B7105[]NHT

LMF325 B7224[]NHT

LMF325 B7474[]NHT

LMF325 B7105[]NHT

X7R

0.022 μ

0.047 μ

0.022 μ

0.047 μ

0.1 μ

±10, ±20

2.5

3.5

200

1.9±0.20

100

0.22 μ

0.47 μ

1 μ

0.22 μ

0.47 μ

1 μ

0.22 μ

0.47 μ

1 μ

0.22 μ

0.47 μ

1 μ

ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

Multilayer Ceramic Capacitors

■PACKAGING

①Minimum Quantity

●Taped package

Thickness

Standard quantity [pcs]

Type(EIA)

code

Paper tape

Embossed tape

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

□MK063(0201)

0.125

－

50000

0.2

C, D

P,T

40000

0.3

15000

10000

－

□WK105(0204) ※

0.3

0.13

0.18

0.2

20000

15000

－

□MK105(0402)

□MF105(0402)

20000

15000

10000

4000

－

0.3

－

0.5

－

□VK105(0402)

□MK107(0603)

□WK107(0306) ※

□MF107(0603)

□VS107(0603)

□MJ107(0603)

0.5

－

0.45

0.5

－

4000

－

0.8

4000

3000

0.7

－

0.8

3000

0.45

0.85

1.25

0.85

1.25

0.85

1.15

1.6

□MK212(0805)

4000

－

□WK212(0508)

□MF212(0805)

※

－

4000

－

3000

－

□VS212(0805)

□MJ212(0805)

－

2000

－

4000

－

□MK316(1206)

□MF316(1206)

3000

2000

3000

2000

－

1.15

1.6

－

□MJ316(1206)

－

0.85

1.15

1.9

－

2000

□MK325(1210)

□MF325(1210)

2.0max.

2.5

－

1000

2000

1.9

□MJ325(1210)

□MK432(1812)

2.5

500(T), 1000(P)

500

2.5

Note : ※ LW Reverse type.

②Taping material

※No bottom tape for pressed carrier tape

●Card board carrier tape

●Embossed tape

Top tape

Base tape

Sprocket hole

Chip cavity

Sprocket hole

Chip cavity

Bottom tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip filled

Chip

※ LW Reverse type.

③Representative taping dimensions

●Paper Tape（8mm wide）

●Pressed carrier tape（ 2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

Ｔ

□MK063(0201)

0.37

0.67

0.45max.

0.42max.

□WK105(0204) ※

□MK105(0402) （*1 C）

□MK105(0402) （*1 P）

2.0±0.05

0.65

1.15

0.4max.

0.3max.

0.42max.

Unit：mm

0.45max.

Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.

●Punched carrier tape （2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK105 (0402)

□MF105 (0402)

□VK105 (0402)

0.65

1.15

2.0±0.05

0.8max.

Unit：mm

●Punched carrier tape （4mm pitch）

φ1.5＋0.1/－0

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK107(0603)

□WK107(0306)

□MF107(0603)

□MK212(0805)

□WK212(0508)

□MK316(1206)

※

1.0

1.8

1.1max.

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.

Unit：mm

●Embossed tape（4mm wide）

Sprocket hole

Unit：mm（inch）

0.9±0.05

φ0.8±0.04

(0.035±0.002)

(φ0.031±0.002)

1.0±0.02

2.0±0.04

(0.039±0.001) (0.079±0.002)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

0.135

0.27

1.0±0.02

0.5max.

0.25max.

Unit：mm

0.23

0.43

●Embossed tape（8mm wide）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK105(0402)

0.6

1.0

1.1

1.8

2.0±0.1

0.6max

1.3max.

0.2±0.1

0.25±0.1

□WK107(0306) ※

□MK212(0805)

1.65

2.0

2.4

3.6

□MF212(0805)

4.0±0.1

□MK316(1206)

□MF316(1206)

3.4max.

0.6max.

□MK325(1210)

2.8

□MF325(1210)

Note： ※ LW Reverse type.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

●Embossed tape（12mm wide）

φ1.5＋0.1/－0

(φ0.059＋0.004/-0)

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

Sprocket hole

4.0±0.1

2.0±0.1

(0.157±0.004)

(0.079±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□MK325(1210)

□MK432(1812)

3.1

3.7

4.0

4.9

8.0±0.1

4.0max.

0.6max.

Unit：mm

④Trailer and Leader

Blank portion

Chip cavity

Blank portion

Leader

100mm or more

160mm or more

(3.94inches or more)

(6.3inches or more)

400mm or more

(15.7inches or more)

Direction of tape feed

⑤Reel size

φ13.0±0.2

φ178±2.0

φ50min.

φ21.0±0.8

2.0±0.5

1.0

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

Unit：mm

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.

Pull direction

0～20°

Top tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Multilayer Ceramic Capacitors

■RELIABILITY DATA

1.Operating Temperature Range

Standard

Temperature

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

X7R

X6S

X7S

X7T

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Note: ※LD Low distortion high value multilayer ceramic capacitor

2. Storage Conditions

Temperature

Standard

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

Specified

Value

X7R

High Permittivity （Class2）

X6S

X7S

X7T

LD(※)

X5R

Note: ※LD Low distortion high value multilayer ceramic capacitor

3. Rated Voltage

Standard

50VDC, 25VDC

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type 50VDC, 25VDC

50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC

High Permittivity （Class2）

4. Withstanding Voltage （Between terminals）

Temperature

Specified

Standard

Compensating（Class1）

High Frequency Type No breakdown or damage

Value

High Permittivity （Class2）

Class 1

Class 2

Rated voltage×2.5

Test

Applied voltage

Methods and

Duration

Rated volta×3

1 to 5 sec.

50mA max.

Remarks

Charge/discharge current

5. Insulation Resistance

Temperature

Standard

High Frequency Type

10000 MΩmin.

Compensating（Class1）

Specified

Value

C≦0.047μF : 10000 MΩ min.

C＞0.047μF : 500MΩ・μF

High Permittivity （Class2） Note 1

Test

Applied voltage

Duration

: Rated voltage

Methods and

Remarks

: 60±5 sec.

: 50mA max.

Charge/discharge current

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

6. Capacitance （Tolerance）

Temperature

0.2pF≦C≦5pF

0.2pF≦C≦10pF

C＞10pF

: ±0.25pF

C□

U□

Standard

: ±0.5pF

: ±5% or ±10%

Compensating（Class1）

Specified

Value

0.3pF≦C≦2pF

C＞2pF

: ±0.1pF

: ±5%

High Frequency Type

BJ, B7, C6, C7, D7, LD(※) : ±10% or ±20%

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

C≦10μF

C＞10μF

Test

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Methods and

Remarks

Measuring frequency

Measuring voltage Note

Bias application

1ＭHz±10%

0.5 to 5Vrms

1kHz±10%

1±0.2Vrms

120±10Hz

0.5±0.1rms

one

7. Q or Dissipation Factor

C＜30pF : Q≧400＋20C

C≧30pF : Q≧1000

Standard

Temperature

Compensating（Class1）

（C：Nominal capacitance）

Specified

Value

High Frequency Type Refer to detailed specification

High Permittivity （Class2） Note 1

BJ, B7, C6, C7, D7：2.5% max.

Class 1

High Frequency Type

None

Class 2

Standard

C≦10μF

C＞10μF

Preconditioning

Thermal treatment （at 150℃ for 1hr） Note 2

Test

Measuring frequey

Measuring voltage Note 1

Bias application

1ＭHz±10%

1GHz

1ｋHz±10%

1±0.2Vrms

120±10Hz

Methods and

Remarks

0.5 to 5Vrms

0.5±0.1Vrms

None

High Frequency Type

Measuring equipment

Measuring jig

: HP4291A

: HP16192A

8. Temperature Characteristic （Without voltage application）

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

G : ±30

H : ±60

J : ±120

K : ±250

C□ :

CG,CH, CJ, CK

UJ, UK

Standard

Temperature

U□ : －750

Compensating（Class1）

SL : ＋350 to －1000

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

H : ±60

High Frequency Type

C□ :

Specified

Value

Capacitance

change

±10%

Reference

Specification

Temperature Range

temperature

20℃

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

X5R

X7R

X6S

X7S

X5R

±15%

25℃

±15%

25℃

High Permittivity （Class2）

±22%

25℃

±22%

25℃

＋22/－33%

±15%

25℃

LD(※)

25℃

Note : ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

（C₈₅－C₂₀）

×10⁶（ppm/℃）

C₂₀×△T

△T＝65

Class 2

Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following

equation.

Test

Methods and

Remarks

Step

X5R、X7R、X6S、X7S、X7T

Minimum operating temperature

20℃

25℃

Maximum operating temperature

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

（C－C₂）

C₂

×100（%）

：Capacitance in Step 1 or Step 3

C2 ：Capacitance in Step 2

9. Deflection

Appearance

: No abnormality

Standard

Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.

Temperature

Compensating（Class1）

Appearance

: No abnormality

: Within±0.5 pF

Specified

Value

High Frequency Type

Cpaitance change

Appearance

: No abnormality

High Permittivity （Class2）

Capacitance change : Within ±12.5%（BJ, B7, C6, C7, D7, LD(※)）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Multilayer Ceramic Capacitors

042, 063, ^※１105 Type

The other types

Board

Glass epoxy-resin substrate

Test

Thickness

Warp

0.8mm

1.6mm

Methods and

Remarks

1mm （Soft Termination type:3mm）

Duration

10 sec.

^※１：105 Type thickness, C： 0.2mm ,P： 0.3mm.

Capacitance measurement shall be conducted

with the board bent

10. Body Strength

Standard

－

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type No mechanical damage.

－

High Permittivity （Class2）

High Frequency Type

Applied force

Duration

: 5N

Test

: 10 sec.

Methods and

Remarks

11. Adhesive Strength of Terminal Electrodes

Temperature

Standard

Specified

Compensating（Class1）

High Frequency Type No terminal separation or its indication.

Value

High Permittivity （Class2）

Multilayer Ceramic Capacitors

042, 063 Type

105 Type or more

Test

Applied force

Duration

Methods and

Remarks

30±5 sec.

12. Solderability

Standard

High Frequency Type At least 95% of terminal electrode is covered by new solder.

Temperature

Specified

Value

Compensating（Class1）

High Permittivity （Class2）

Eutectic solder

H60A or H63A

230±5℃

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Test

Solder type

Methods and

Remarks

Solder temperature

Duration

4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

13. Resistance to Soldering

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitancecange

: Within ±2.5%

: Initial value

Specified

Value

High Frequency Type

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abormality

Capactace change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within ±7.5%（BJ, B7, C6, C7, D7, LD(※)）

: Initial value

High Permittivity （Class2） Note 1

: Initial value

（between terminals）: No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

lss 1

042, 063 Type

105 Type

Preconditioning

Preheating

None

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

6 to 24 hrs （Standard condition） Noe 5

Test

Methods and

Remarks

Class 2

105, 107, 212 Type

042、063 Type

316, 325 Type

Preconditioning

Preheating

Thermal treatment （at 150℃ for 1 hr） Note 2

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

80 to 100℃, 5 to 10 min.

150 to 200℃, 5 to 10 min.

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

24±2 hrs （Standard condition） Note 5

14. Temperature Cycle (Thermal Shock）

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: Within ±0.25pF

Specified

Value

High Frequency Type

: Initial value

Insulation resistance

Withstanding voltage

（between terminals） : No abnormality

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within ±7.5% （BJ, B7, C6, C7, D7, LD(※)）

: Initial value

High Permittivity （Class2） Note 1

: Initial value

（between terminals） : No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

None

Class 2

Thermal treatment （at 150℃ for 1 hr）

Note 2

Preconditioning

Step

Temperature（℃）

Time（min.）

Test

Minimum operating temperature

Normal temperature

30±3

2 to 3

30±3

2 to 3

Methods and

Remarks

1 cycle

Maximum operating temperature

Normal temperature

Number of cycles

Recovery

5 times

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

15. Humidity （Steady State）

Appearance

: No abnormality

Capacitance change

: Within ±5% or ±0.5pF, whichever is larger.

: C＜10pF : Q≧200＋10C

Standard

10≦C＜30pF : Q≧275＋2.5C

C≧30pF:Q≧350（C：Nominal capacitance）

: 1000 MΩmin.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

Specified

Value

: No abnormality

: Within ±0.5pF,

: 1000 MΩmin.

High Frequency Type Capacitance change

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）

: 50 MΩμF or 1000 MΩwhichever is smaller.

High Permittivity （Class2） Note 1

Dissipation factor

Insulation resistance

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

All items

Standard

40±2℃

High Frequency Type

60±2℃

Preconditioning

Temperature

Humidity

None

Thermal treatment（ at 150℃ for 1 hr） Note 2

40±2℃

Test

Methods and

Remarks

90 to 95%RH

Duration

500＋24/－0 hrs

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

16. Humidity Loading

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger.

: C＜30pF：Q≧100＋10C/3

Standard

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩmin.

Insulation resistance

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: C≦2pF：Within ±0.4 pF

C＞2pF：Within ±0.75 pF

（C：Nominal capacitance）

: 500 MΩmin.

Specified

Value

High Frequency Type

Insulation resistance

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max. （BJ, B7, C6, C7, D7, LD(※)）

: 25 MΩμF or 500 MΩ, whichever is smaller.

High Permittivity （Class2） Note 1

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

Standard

High Frequency Type

All items

Preconditioning

Voltage treatment

None

（Rated voltage are applied for 1 hour at 40℃） Note 3

Temperature

Humidity

40±2℃

60±2℃

40±2℃

Test

Methods and

Remarks

90 to 95%RH

500＋24/－0 hrs

Rated voltage

90 to 95%RH

Duration

500＋24/－0 hrs

Rated voltage

Applied voltage

Charge/discharge

current

50mA max.

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs（Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

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17. High Temperature Loading

Appearance

: No abnormality

Capacitance change

: Within ±3% or ±0.3pF, whichever is larger.

: C＜10pF： Q≧200＋10C

Standard

10≦C＜30pF：Q≧275＋2.5C

C≧30pF： Q≧350（C：Nominal capacitance）

: 1000 MΩmin.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

Specified

Value

: No abnormality

High Frequency Type Capacitance change

Insulation resistance

: Within ±3% or ±0.3pF, whichever is larger.

: 1000 MΩmin.

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）

: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）

: 50 MΩμF or 1000 MΩ, whichever is smaller.

High Permittivity （Class2） Note 1

Dissipation factor

Insulation resistance

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

BJ, LD(※)

B7, C7, D7

Voltage treatment（Twice the rated voltage shall be applied for

1 hour at 85℃, 105℃ or 125℃） Note 3, 4

Maximum operating temperature

Preconditioning

None

Temperature

Duration

Maximum operating temperature

1000＋48/－0 hrs

Test

1000＋48/－0 hrs

Methods and

Remarks

Applied voltage

Charge/discharge

current

Rated voltage×2

Rated voltage×2 Note 4

50mA max.

Recovery

6 to 24hr （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

Note: ※LD Low distortion high value multilayer ceramic capacitor

Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.

Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for

24±2hours.

Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.

Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning

measurement results, in order to provide correlation data, the test shall be conducted under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the

"standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_reli_e-E06R01

Medium-High Voltage Multilayer Ceramic Capacitor

■RELIABILITY DATA

1. Operating Temperature Range

Temperature Compensating(High Frequency type)

CG(C0G)

: －55 to ＋125℃

Specified Value

High permittivity

X7R, X7S : －55 to ＋125℃

: －55 to ＋85℃

: －25 to ＋85℃

2. Storage Temperature Range

Temperature Compensating(High Frequency type)

CG(C0G) : －55 to ＋125℃

Specified Value

High permittivity

X7R, X7S : －55 to ＋125℃

X5R

: －55 to ＋85℃

: －25 to ＋85℃

3. Rated Voltage

Specified Value

100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ)

4. Withstanding Voltage（Between terminals）

Specified Value

No breakdown or damage

Applied voltage

Duration

: Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ）

Test Methods and

Remarks

: 1 to 5sec.

: 50mA max.

Carge/discharge current

５．Insulation Resistance

Temperature Compensating(High Frequency type)

10000MΩ min

Specified Value

High permittivity

100MΩμF or 10GΩ, whichever is smaller.

Applied voltage

Duration

: Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ）

Test Methods and

Remarks

: 60±5sec.

: 50mA max.

Charge/discharge current

6．Capacitance （Tolerance）

Temperature Compensating(High Frequency type)

±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF)

Specified Value

High permittivity

±10%, ±20%

Temperature Compensating(High Frequency type)

Measuring frequency

Measuring voltage

Bias application

: 1MHz±10%

: 0.5 to 5Vrms

: None

Test Methods and

Remarks

High permittivity

Measuring frequency

Measuring voltage

Bias application

: 1kHz±10%

: 1±0.2Vrms

: None

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

7．Q or Dissipation Factor

Temperature Compensating(High Frequency type)

C＜30pF : Q≧800＋20C

C≧30pF : Q≧1400

C:Normal Capacitance(/pF)

Specified Value

High permittivity

3.5%max（HMK,HMJ）

2.5%max（QMK,QMJ, SMK,SMJ）

Temperature Compensating(High Frequency type)

Measuring frequency

Measuring voltage

Bas application

: 1MHz±10%

: 0.5 to 5Vrms

: None

Test Methods and

Remarks

High permittivity

Measuring frequency

Measuring voltage

Bas application

: 1kHz±10%

: 1±0.2Vrms

: None

8．Temperature Characteristic of Capacitance

Temperature Compensating(High Frequency type)

C0G :±30ppm（25 to ＋125℃）

High permittivity

Specified Value

: ±10%（－25 to ＋85℃）

X5R

X7R

X7S

: ±15%（－55 to ＋85℃）

: ±15%（－55 to ＋125℃）

: ±22%（－55 to ＋125℃）

Temperature Compensating(High Frequency type)

Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

ｆollowing equation.

（C₈₅－C₂₅）

×10⁶×[ppm/℃]

C₂₅×ΔT

High permittivity

Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

Test Methods and

Remarks

Step

X5R、X7R、X7S

Minimum operating tempeature

20℃ 25℃

Maximum operating temperature

（C－C₂）

C₂

×100（%）

: Capacitance value in Step 1 or Step 3

C2 : Capacitance value in Step 2

9．Deflection

Temperature Compensating(High Frequency type)

Appearance

Capacitance change

: No abnormality

:±5% or ±0.5pF, whichever is larger.

Specified Value

High permittivity

Appearance

: No abnormality

: Within±10%

Capacitance change

Warp

: 1mm （Soft Termination type:3mm）

: 10sec.

Duration

Test board

Thicknss

: Glass epoxy-resin substrate

: 1.6mm

Test Methods and

Remarks

Capacitance measurement shall be conducted with the board bent.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

10．Adhesive Strength of Terminal Electrodes

Specified Value

No terminal separation or its indication.

Temperature Compensating(High Frequency type)

Applied force

Duration

: 2N

: 10±5sec.

Test Methods and

Remarks

High permittivity

Applied force

Duration

: 5N

: 30±5sec.

11．Solderability

Specified Value

At least 95% of terminal electrode is covered by new solder

Eutectic solder

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Solder type

H60A or H63A

230±5℃

Test Methods and

Remarks

Solder temperature

Duration

4±1 sec.

12．Resistance to Soldering

Temperature Compensating(High Frequency type)

Appearance : No abnormality

Capacitance change

Insulation resistance

Withstanding voltage

: C※≦10pF :±0.25pF C※＞10pF :±2.5% ※Normal capacitance

: Initial value

（between terminals） : No abnormality

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ）

: Inital value

: Initial value

（between terminals） : No abnormality

Preconditioning

Solder temperature

Duration

: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)

: 270±5℃

: 3±0.5sec.

Test Methods and

Remarks

Preheating conditions

Recovery

: 80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5min.

: 24±2hrs under the stadard condition Note3

13．Temperature Cycle （Thermal Shock）

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

Insulation resistance

Withstanding voltage

: C※≦10pF :±0.25% C※＞10pF :±2.5%

: Initial value

（between terminals） : No abnormality

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

Withstanding voltage

: Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ）

: Initial value

（between terminals） : No abnormality

Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1

Conditions for 1 cycle

Step

temperature（℃）

Minimum operating temperature

Normal temperature

Time（min.）

30±3min.

2 to 3min.

30±3min.

2 to 3min.

Test Methods and

Remarks

Maximum operating temperature

Normal temperature

Number of cycles : 5 times

Recovery : 24±2hrs under the standard condition Note3

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

14．Humidity （Steady state）

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

Insulation resistance

: C※≦10pF :±0.5pF C※＞10pF :±5% ※Normal capacitance

: 1000MΩmin

Specified Value

High permittivity

Appearance

: No abnormality

: Within±15%

Capacitance change

Dissipation factor

Insulation resistance

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 25MΩμF or 1000MΩ, whichever is smaller.

Preconditioning

Temperature

Humidity

: Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)

: 40±2℃

Test Methods and

Remarks

: 90 to 95%RH

Duration

: 500 ＋24/－0 hrs

Recovery

: 24±2hrs under the standard condition Note3

15．Humidity Loading

Temperature Compensating(High Frequency type)

Appearance

: No abnormality

Capacitance change

: C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5%

: ※Normal capacitance

: 500MΩmin

Insulation resistance

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 10MΩμF or 500MΩ, whichever is smaller.

According to JIS 5102 clause 9.9.

Preconditioning

Temperature

: Voltage treatment Note2 (Only High permittivity)

: 40±2℃

Test Methods and Humidity

Remarks Applied voltage

: 90 to 95%RH

: Rated voltage

Charge/discharge current

Duration

: 50mA max.

: 500 ＋24/－0 hrs

: 24±2hrs under the standard condition Note3

Recovery

16．High Temperature Loading

Appearance

Temperature Compensating(High Frequency type)

: No abnormality

Capacitance change

: C※≦10pF :±0.3pF C※＞10pF :±3%

:1000MΩmin

Insulation resistance

Specified Value

High permittivity

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.

: 50MΩμF or 1000MΩ, whichever is smaller.

According to JIS 5102 clause 9.10.

Preconditioning

Temperature

: Voltage treatment Note2 (Only High permittivity)

: Maximum operating temperature

Test Methods and

Remarks

Applied voltage

Charge/discharge current

Duration

: Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ）

: 50mA max.

: 1000 ＋24/－0 hrs

Recovery

: 24±2hrs under the standard condition Note3

Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature

for 24±2hours.

Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa

When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted

under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa

Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_mhv_reli_e-E06R01

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

Precautions

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

Land patterns for PCBs

Land pattern

（unit: mm）

Solder-resist

Wave-soldering

Chip capacitor

Type

107

1.6

212

2.0

316

3.2

325

3.2

Size

0.8

1.25

1.6

2.5

0.8 to 1.0

0.5 to 0.8

0.6 to 0.8

1.0 to 1.4

0.8 to 1.5

0.9 to 1.2

1.8 to 2.5

0.8 to 1.7

1.2 to 1.6

1.8 to 2.5

0.8 to 1.7

1.8 to 2.5

Chip capacitor

Reflow-soldering

Type 042

Technical

063

0.6

105

1.0

107

1.6

0.8

212

2.0

316

325

432

4.5

considerations

0.4

3.2

2.5

Size

0.2

0.3

0.5

1.25

1.6

3.2

0.15 to 0.25

0.15 to 0.20

0.15 to 0.30

0.20 to 0.30

0.25 to 0.40

0.45 to 0.55

0.40 to 0.50

0.45 to 0.55

0.8 to 1.0

0.8 to 1.2

0.9 to 1.6

1.8 to 2.5

1.0 to 1.5

1.2 to 2.0

1.8 to 2.5

1.0 to 1.5

1.8 to 3.2

2.5 to 3.5

1.5 to 1.8

2.3 to 3.5

0.6 to 0.8

Note：Recommended land size might be different according to the allowance of the size of the product.

LWDC

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type

105

0.52

107

0.8

212

1.25

Size

1.0

1.6

2.0

0.18 to 0.22

0.2 to 0.25

0.9 to 1.1

0.25 to 0.3

0.3 to 0.4

1.5 to 1.7

0.5 to 0.7

0.4 to 0.5

1.9 to 2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E07R01

（2）Examples of good and bad solder application

Items

Not eommended

Recommended

Solder-resist

Lead wire of component

Mixed mounting of SMD and

leaded components

Chassis

Solder-resist

Solder (for grounding)

Component placement close to

the chassis

Electrode pattern

Lead wire of component

Soldering iron

Solder-resist

Hand-soldering of leaded

Components near mounted

components

Solder-resist

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any

stresses from board warp or deflection.

possible mechanical

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

Perforation

Slit

Magnitude of stress A＞B＝C＞D＞E

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E07R01

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

Items

Not recommended

Recommended

chipping

or cracking

Single-sided mounting

supporting pins

or back-up pins

Double-sided mounting

chipping

or cracking

supporting pins

or back-up pins

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

Technical

considerations

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Amount adhesive

After capacitor are bonded

Figure

212/316 case sizes as examples

0.3mm min

100 to 120μm

Adhesives shall not contact land

4. Soldering

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

Technical

considerations

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E07R01

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

100 to 130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

［Reflow soldering］

【Recommended conditions for eutectic soldering】

300

【Recommended condition for Pb-free soldering】

300

Peak

Preheating

230℃

Within 10sec.

260℃ Max.

Within 10sec.

60sec. 60sec

Min.

200

100

200

Slow

Slow cooling

cooling

100

Heating above

230℃

Preheating150℃

60sec. Min.

40sec. Max.

1/2T～1/3T

Capacitor

PC board

Caution

Solder

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible.

③Allowable number of reflow soldering : 2 times max.

［Wave soldering］

【Recommended conditions for eutectic soldering】

300

【Recommended condition for Pb-free soldering】

300

Peak

260℃ Max.

Within 10sec.

230～250℃

Within 3sec.

Preheating

120sec. Min.

200

100

Slow

Slow cooling

Preheating

150℃

cooling

100

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only.

②Allowable number of wave soldering : 1 times max.

［Hand soldering］

【Recommended conditions for eutectic soldering】

400

【Recommended condition for Pb-free soldering】

400

300

200

100

Peak

350℃ Max.

Within 3sec.

Peak

280℃ Max.

Within 3sec.

230～280℃

Within 3sec.

300

⊿T

Slow cooling

200

Slow cooling

⊿T

200

Slow cooling

Preheating

150℃ Min.

Preheating

150℃ Min.

100

Preheating

60sec. Min.

⊿T

316type or less

⊿T≦150℃

325type or more

⊿T≦130℃

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

③Allowable number of hand soldering : 1 times max.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E07R01

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead

the capacitors.

to the

Technical

cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall

be carefully checked;

considerations

Ultrasonic output :

20 W/ℓ or less

40 kHz or less

Ultrasonic frequency :

Ultrasonic washing period : 5 min. or less

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the

while left under normal storage conditions resulting in the deterioration of the capacitor's performance.

hardening period or

Precautions

7. Handling

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

Precautions

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or

components.

8. Storage conditions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity

: Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so

care shall be

taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at

150℃ for 1hour.

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

Technical

considerations

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_prec_e-E07R01

High Reliability Application Multilayer Ceramic Capacitors

■RELIABILITY DATA

1. Operating Temperature Range

Specified Value

X7R（－55℃ to ＋125℃）

Test Methods and

Remarks

Continuous use is available in this range. （reference temperature : 25℃）

2.Highest Operating temperature Range

Specified Value

X7R（－55℃ to ＋125℃）

Maximum ambient temperature at which capacitors can be continuously used with rated voltage applied.

Test Methods and

Remarks

3. Rated Voltage

Specified Value

Please refer to the page of the "PART NUMBERS".

Test Methods and Continuous maximum applied voltage. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than

Remarks the rated voltage of the capacitor.

4. Shape and Dimensions

Specified Value

Please refer to the page of the "EXTERNAL DIMENSIONS".

５. Heat Treatment （ClassⅡ）

Test Methods and Initial value shall be measured after test sample is heat－treated at 150＋0/－10℃ for an hour and kept at room temperature for 24 ±

Remarks

2 hours.

6. Voltage Treatment （ClassⅡ）

Test Methods and Initial value shall be measured after test sample is voltage－treated for an hour at temperature and voltage which are specified as test

Remarks

conditions, and kept at room temperature for 24 ±2 hours.

７. Dielectric Withstanding Voltage （between terminals）

Specified Value

No abnormality.

Applied voltage

Duration

: Rated voltage × 2.5

: 1 to 5 seconds.

Test Methods and

Remarks

Charging and discharging current shall be 50mA max.

8. Insulation Resistance

Specified Value

Larger than whichever smaller of 500 MΩ・μF or 10⁴MΩ

Applied voltage

Duration

: Rated voltage

Test Methods and

Remarks

: 60±5 seconds.

Charging and discharging current shall be 50mA max.

9. Capacitance and Tolerance

Specified Value Please refer to the page of the "PART NUMBERS".

Measurement frequency

: 1kHz±10%（C≦10μF）

Test Methods and Measurement voltage

Remarks

: 1±0.2Vrms（C≦10μF）

0.5±0.1V（6.3V rated voltage）

Heat treatment specified in No.5 of the specification shall be conducted prior to measurement.

10. Q or Dissipation factor （tanδ）

Specified Value Please refer to the page of the "PART NUMBERS".

Measurement frequency

: 1kHz±10%（C≦10μF）

Test Methods and Measurement voltage

Remarks

: 1±0.2Vrms（C≦10μF）

0.5±0.1V（6.3V rated voltage）

Heat treatment specified in No.5 of the specification shall be conducted prior to measurement. NO DC bias is applied.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_reli_e-E06R01

11. Temperature Characteristic （without DC bias）

Specified Value

X7R（－55℃ to ＋125℃）：±15%

Confirming to EIA RS－198－D （1991）

Heat treatment specified in No.5 of the specification shall be conducted prior to measurement.

Change of the maximum capacitance deviation in step 1 to 5.

step

Temperature（℃）

Test Methods and

Remarks

＋25

Minimum operating temperature

＋25

Maximum operating temperature

＋25

12. Adhesive Force of Terminal Electrodes

Specified Value

Appearance：Terminal electrodes shall be no exfoliation or a sign of exfoliation.

Solder lands refer to fig.1.

1608 size

larger than 2012 size

10Ｎ

Applying force

Duration

30±5 seconds.

Board

Glass epoxy-resin substrate

1.6mm

Thickness

Test Methods and

Remarks

Case size

Dimension

1608

1.0

2012

3216

2.2

3225

2.2

1.2

4.0

3.0

5.0

1.2

1.65

2.0

2.9

Fig.1

13. Vibration

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Initial value shall be satisfied.

Specified Value

Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is

heat treated as specified in No.5.

Solder lands refer to figure 1.

Test Methods and

Remarks

Direction of the vibration test

Vibrationfrequency

: X, Y, Z each of 3 orientations for 2 hours respectively （total 6 hours）

: 10 to 55 to 10Hz （1 minutes each）

: 1.5 mm

Total amplitude

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

14. Resistance to Soldering Heat

Appearance

: No abnormality

: ≦±7.5%

Capacitance change

Specified Value

Dissipation ｆactor

: Initial value shall be satisfied.

（between terminals） : No abnormality

Insulation resistance

Dielectric withstanding voltage

Heat treatment specified in No.5 of the specification shall be conducted prior to test.

Immerse test sample in an solder solution （Sn-3Ag-0.5Cu）.

Soldering temperature

Test Methods and Duration

: 270℃±5℃

: 3±0.5 seconds

Remarks

Soaking position

Preheating condition

: Test sample is soaked until the termnal electrode is covered in solder solution.

: 3216 size or smaller size：120 to 150℃ for 1 minute,

3225 size：100 to 120℃ for 1 minute, 170 to 200℃ for 1 minute.

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

15. Solderability

Specified Value

More than 95% of terminal electrode shall be covered with fresh solder.

Heat treatment specified in No.5 of the specification shall be conducted prior to test.

Immerse test sample in an solder solution（Sn-3Ag-0.5Cu）.

Test Methods and

Remarks

Soldering temperature

Duration

: 245℃±5℃

: 4±1 seconds

Dipping position

: Test sample is immersed until the terminal electrode is covered in solder solution.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_reli_e-E06R01

16. Thermal shock

Specified Value

Appearance

: No abnormality

Capacitance change

Dissipation factor

: ≦±7.5%

: Initial value shall be satisfied.

（between terminals） : No abnormality

Insulation resistance

Dielectric withstanding voltage

Heat treatment specified in No.5 of the specification shall be conducted prior to test.

Measurement shall be conducted after test sample is heat treated as specified in No.5.

condition of the one cycle （Air－Air）

Step

Temperature（℃）

Time（min.）

Transfer time

within 20 seconds

Minimum usage temperature

Maximum usage temperature

Test cycles：100 times.

Test Methods and

Remarks

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

Case size

Dimension

1608

0.6

2012

0.8

3216

2.0

3225

2.0

2.2

3.0

4.4

0.9

1.3

1.7

2.6

Fig.2

17. Humidity Loading

Appearance

: No abnormality

: ±12.5%

Specified Value

Note1

Capacitance change

Dissipation factor

Insulation resistance

: 5.0%max.

: Larger than whichever smaller of 25MΩ・μF or 500MΩ

Test condition

Duration

: 85℃/85%RH.

: 1000 ＋48/－0 hours.

: Applied rated voltage.

Test Methods and

Remarks

DC bias

Voltage treatment specified in No.6 of the specification shall be conducted prior to test.

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

18. High Temperature Loading

Appearance

: No abnormality

Specified Value

Note1

Capacitance change

Dissipation factor

: ≦±12.5%

: 5.0%max.

Insulation resistance

: Larger than whichever smaller of 25MΩ・μF or 500MΩ

Voltage treatment specified in No.6 of the specification shall be conducted prior to test.

Test sample shall be put in thermostatic oven with maximum temperature.

Test Methods and Applied voltage

Remarks Duration

: Rated voltage x 2

: 1000 ＋48/－0 hours.

Charging and discharging current shall be 50mA or less.

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

19. Resistance to Flexure of substrate

Appearance

: No abnormality

: ≦±12.5%

Capacitance change

Specified Value

Dissipation factor

: 5.0%max.

Insulation resistance

: Initial value shall be satisfied.

Warp

: 1ｍｍ

Testing board

Thickness

: Grass epoxy - resin substrate

: 1.6ｍｍ

Test board and solder lands

: Refer to fig. 3.

Case size

Test Methods and

Remarks

Dimension

1608

0.6

2012

3216

2.0

3225

2.0

0.8

3.0

1.3

2.2

4.4

0.9

1.7

2.6

Fig.4

Fig.3

Measurement shall be made with board in the bent position.（fig.4）

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_reli_e-E06R01

20. High Temperature Exposure

Appearance

: No abnormality

Specified Value

Note1

Capacitance change

: ≦±12.5%

Dissipation factor

: 5.0%max.

Insulation resistance

: Larger than whichever smaller of 500MΩ・μF or 10000MΩ

Heat treatment specified in No.5 of the specification shall be conducted prior to test.

Test sample shall be put in thermostatic oven with maximum temperature.

Duration : 1000 ＋48/－0 hours.

Test Methods and

Remarks

Initial value shall be measured after test sample is heat－treated specified No.5.

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

21. Temperature Cycling

Appearance

: No abnormality

Specified Value

Note1

Capacitance change

Dissipation factor

: ≦±7.5%

: Initial value shall be satisfied

Insulation resistance

Heat treatment specified in No.5 of the specification shall be conducted prior to test.

Measurement shall be conducted after test sample is heat treated as specified in No.5.

condition of the one cycle

Step

Temperature（℃）

Minimum usage temperature

＋25

Time（min.）

30±3

Test Methods and

Remarks

2 to 3

Maximum usage temperature

＋25

30±3

2 to 3

Test cycles：200 times

Solder lands refer to fig. 2.

Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.

22. Body strength

Specified Value

No mechanical damage

Applying force

Applying time

: 10Ｎ

: 10 seconds

Test Methods and

Remarks

Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_reli_e-E06R01

Precautions on the use of High Reliability Application Multilayer Ceramic Capacitors

■PRECAUTIONS

1.Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social

ramifications.

As such, any capacitors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly

differentiated from components used in general purpose applications.

◆Operating Voltage （Verification of Rated voltage）

Precautions

1. The operating voltage for capacitors must always be lower than their rated values.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor

chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than

the capacitor's rated voltage.

2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC

voltage or a pulse voltage having rapid rise time is present in the circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on a PCB, the amount of solder used （size of fillet） can directly affect capacitor performance. Therefore,

the following items must be carefully considered in the design of solder land patterns:

（1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or

cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder

pads which in turn determines the amount of solder necessary to form the fillets.

Precautions

（2）When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's

soldering point is separated by solder-resist.

◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards）

1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing

processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered

boards etc.） For this reason, planning pattern configurations and the position of SMD capacitors should be carefully performed to

minimize stress.

◆Pattern configurations （Design of Land-patterns）

1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. （larger fillets

which extend above the component end terminations） Examples of improper pattern designs are also shown.

（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs

Recommended land dimensions for reflow-soldering（unit: mm）

Land patterns for PCBs

Land pattern

Type

107

1.6

212

2.0

316

3.2

325

3.2

Solder-resist

Chip capacitor

Size

0.8

1.25

1.6

2.5

0.8～1.0

0.6～0.8

0.8～1.2

0.9～1.6

1.8～2.5

1.0～1.5

1.2～2.0

1.8～2.5

1.0～1.5

1.8～3.2

Chip capacitor

Technical

considerations

Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing

land-patterns.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_prec_e-E07R01

（2）Examples of good and bad solder application

Items

Not recommended

Recommended

Solder-resist

Lead wire of component

Mixed mounting of SMD and

leaded components

Chassis

Solder-resist

Solder (for grounding)

Component placement close to

the chassis

Electrode pattern

Lead wire of component

Soldering iron

Solder-resist

Hand-soldering of leaded

components near mounted

components

Solder-resist

Horizontal component

placement

◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards）

1-1. The following is examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical

stresses from board warp or deflection.

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary

depending on capacitor layout. The example below shows recommendations for better design.

Perforation

Slit

Magnitude of stress A＞B＝C＞D＞E

1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the

method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and

perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_prec_e-E07R01

3.Soldering

◆Selection of Flux

1. Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used should be with less than or equal to 0.1 wt% （equivalent to chlorine） of halogenated content. Flux having strong acidity

content should not be applied.

（2）When soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level.

（3）When using water-soluble flux, special care should be taken to properly clean the boards.

◆Soldering

Precautions

1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.

Sn-Zn solder paste can affect MLCC reliability performance.

Please contact us prior to usage.

◆Selection of Flux

1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate the flux, or highly acidic flux is used, an excessive

amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the

surface of the capacitors.

1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may

detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high

humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The

cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.

◆Soldering

1-1. Preheating when soldering

Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.

Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.

Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore,

the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

【Recommended conditions for soldering】

［Reflow soldering］

【Recommended conditions for Pd Free soldering】

Temperature profile

300

Preheating

300

Peak

260℃ Max.

Within 10sec.

230℃

Within 10sec.

Technical

60sec. 60sec

Min.

considerations

Min.

200

100

200

Slow

cooling

Slow cooling

100

Heating above

230℃

40sec. Max.

Preheating150℃

60sec. Min.

※Ceramic chip components should be preheated to within 100 to

130℃ of the soldering.

※Assured to be reflow soldering for 2 times.

Caution

①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below:

1/2T～1/3T

Capacitor

Solder

PC board

②Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended

times as possible.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

hq_c_mlcc_hra_prec_e-E07R01

TMJ316BB7474KLHT [TAIYO YUDEN]

相关型号：

TMJ316BB7474ML8T

TMJ316BB7474MLHT

TMJ316BB7475KL8T

TMJ316BB7475KLHT

TMJ316BB7475ML8T

TMJ316BB7475MLHT

TMJ320C6211GDP167

TMJ320C6211GFN167

TMJ320C6211GGP167

TMJ320C6211GHK167

TMJ320C6211GJC167

TMJ320C6211GJL167